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Optimizing design in packaging structure and using advanced material with high thermal conductivity effectively improve the ability of heat dissipation to ensure a higher output power.

Theoretical study and analysis of the mechanism of thermal stress on the performance of high-power diode lasers enable us to develop the advanced thermal management technology which can lower and homogenize the thermal stress, and improve the device performance, e.g., lower smile, higher degree of polarization (DoP) and narrower spectrum.

Surface treatment techniques greatly improve wettability and bonding strength of packaging materials, enhancing long-term reliability. An in-house developed gold-tin eutectic alloy film process further makes the bonding stable and indium-free.

Focuslight homogenizers can produce many different beam shapes, making them extremely versatile in use.

Shaping and conversion of up to 12 symmetrical laser beams (e.g. Gaussian profile) into an ultra-uniform high-energy-density line beam. Our 750 mm UV-Line system has been used in the most advanced flexible OLED production line in the world, with uniformity of over 97%.

Using advanced mask alignment systems, multiple optical wafers and rigid spacers are aligned and stacked with micron-level accuracy. This process enables highly compact, barrel-free, and reflowable optical lens modules with high integration density, which can further incorporate additional functionalities such as apertures, optical coatings, and spectral filters, offering cost-effective and scalable module solutions.

A proprietary laser-based process that enables high-precision, high-repeatability production of optical components at large scale and low cost. It can prepare 12-inch (300mm×300mm) glass micro-optics wafers and refractive micro-lens elements (ROE).

A precise micro and nano-optical manufacturing technique for optics components based on silicon and fused silica.
Utilizes photolithography and reactive ion etching (RIE) to achieve accurate shaping, sizing, and positioning.
Enables batch manufacturing of high-precision micro and nano-optical structures on wafers up to 8 inches in size.